Hte Labs - STANDARD THIN FILM PROCESSES

HTE Labs
STANDARD THIN
FILM PROCESSES

HTE LABS is helping customers to solve R&D problems, capacity problems, lower cost as well as develop a back-up process for existing in-house operations.

The following are some of the standard thin film processes that can be tailored to customer’s particular needs.

HTE LABS THIN FILM PROCESSES

PLATINUM SILICIDE, PALLADIUM SILICIDE

TiW/Au METALLIZATIONS FOR BIPOLAR AND DMOS, LDMOS RF DEVICES

Ti/Ni/Ag BACKSIDE METALLIZATIONS FOR SOFT SOLDER DIE ATTACHING

Ti/Ni/Ag DEPOSITION and LIFT-OFF PROCESS

Ti/Pd/Au DEPOSITION and LIFT-OFF PROCESS

Au BACKSIDE METALLIZATIONS

Au BUMP PROCESS FOR FLIP CHIP APPLICATIONS

SOLDER BUMP PROCESS FOR FLIP CHIP APPLICATONS

Any company currently involved or contemplating R&D related to semiconductor devices or thin film technologies, is encouraged to consider using HTE LABS expertise and capabilities.
To contact HTE LABS and discuss an application in the strictest confidentiality, navigate to CONTACT PAGE.

Home Corporate Information USA Sales Reps International Sales Reps