HTE Labs
STANDARD THIN
FILM PROCESSES

HTE LABS THIN FILM PROCESSES
PLATINUM SILICIDE, PALLADIUM SILICIDE
TiW/Au METALLIZATIONS FOR BIPOLAR AND DMOS, LDMOS  RF DEVICES
Ti/Ni/Ag BACKSIDE METALLIZATIONS FOR SOFT SOLDER DIE ATTACHING
Ti/Ni/Ag DEPOSITION and LIFT-OFF PROCESS
Ti/Pd/Au DEPOSITION and LIFT-OFF PROCESS
Au BACKSIDE METALLIZATIONS
Au BUMP PROCESS FOR FLIP CHIP APPLICATIONS
SOLDER BUMP PROCESS FOR FLIP CHIP APPLICATONS

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