HTE Labs provides process specialties bipolar wafer foundry, BICMOS wafer foundry, thin film vacuum deposition services, applied thin film processing for analog and mixed signal bipolar manufacturing processes, Analog CMOS wafer foundry, R&D support, research and development support for microelectronics and process specialties wafer Fab processing to customers from semiconductors and microelectronics industry. Bipolar wafer foundry includes the following processes: 20V bipolar process,45V bipolar process,75V bipolar process,25V super-beta bipolar process and high voltage dielectric isolated bipolar processes. R&D support is provided in the following fields of microelectronics: test and measurement, medical instrumentation, industrial process control and communications, thin film active and passive components technologies, flip chip technology (TiW/Cu/Cu/SnPb), MEMS technology, smart sensor technologies (inertial, pressure, temperature, gas and smoke detectors), optoelectronic technologies and components, discrete and integrated circuits technology development for special applications, LiNbO3 applications including SAW, Ti diffusion, light wave guides and Mach-Zender light modulators. Specialty wafer Fab processing: epi deposition, epitaxy, SiGe, epi, diffusion and oxidation, ion implant, LPCVD nitride, PECVD nitride Si3N4, SiO2, platinum silicidation, photo-lithography, plasma etching, silicon micro-machining with KOH anisotropic etch, backside sputter depositions of Ti/Ni/Ag, gold deposition, gold alloy, lift off processes, Ti/Pt/Au lift off process, sputter depositions of thin film resistors : SiCr, NiCr, TaN2, silicon wafers back grind and polish followed by tri-metal backside sputter depositions, gold backside sputter depositions and alloy : gold electroplating and gold bump, wafer probing, dicing services, wafer saw, package development, solid via packages, packaging and test services, failure analysis services, SEM, scanning electron microscopy, ellipsometer measurements, four point probe measurements. CUSTOMER LOGIN TECHNICAL SUPPORT LIVE TECH SUPPORT REQUEST FOR QUOTE ORDER HTE LABS CAPABILITIES BIPOLAR WAFER FOUNDRY VIRTUAL FAB: BUILD PROCESS RUN CARD ON LINE DEVICE MODELING 5V BIPOLAR PROCESS SUBSTRATE MATERIALS LPCVD DEPOSITIONS CIRCUIT SIMULATION 10V BIPOLAR PROCESS SUBSTRATE CLEANING PECVD DEPOSITIONS LAYOUT DESIGN 20V BICMOS PROCESS EPITAXIAL DEPOSITION SPUTTER DEPOSITIONS PROCESS SIMULATION 20V BIPOLAR PROCESS OXIDATION LIFT OFF PROCESS MASKS MANUFACTURING 25V SUPER BETA PROCESS PHOTOLITHOGRAPHY BACKLAP / POLISH WAFER FOUNDRY 25V BIPOLAR + JFET PROCESS WET ETCHING BACKSIDE METALLIZATION HTE Labs WAFER PROBE TEST 25V BIPOLAR +DMOS PROCESS KOH ANISOTROPIC ETCH ANNEAL LASER TRIM / MACHINING 45V BIPOLAR PROCESS MESA ETCH E-TEST BACK GRIND / POLISHING 75V BIPOLAR PROCESS DRY ETCH WAFER PROBE SEMICONDUCTORS BACKSIDE METALLIZATION 100V BIPOLAR PROCESS DOPING SOLDER BUMPING WAFER FOUNDRY PACKAGING 150V BIPOLAR PROCESS ION IMPLANT DICING APPLIED THIN FILMS FAILURE ANALYSIS 300V BIPOLAR PROCESS DIFFUSION DIE ATTACH CONTRACT R&D SUPPORT LIFE TEST CLASS H 400V BIPOLAR PROCESS ANNEAL/DIFFUSION WIRE BONDING SEM 500V BIPOLAR PROCESS SOG DEPOSITIONS PACKAGING MOLDING silicon wafers, silicon, silicon slices, prime silicon wafers, test silicon wafers, particle monitor silicon wafers, furnace silicon wafers, mechanical silicon wafers, silicon wafer processing, silicon wafer services silicon wafers, silicon, silicon slices, prime silicon wafers, test silicon wafers, particle monitor silicon wafers, furnace silicon wafers, mechanical silicon wafers, silicon wafer processing, silicon wafer services, silicon wafers, silicon, silicon slices, prime silicon wafers, test silicon wafers, particle monitor silicon wafers, furnace silicon wafers, mechanical silicon wafers, silicon wafer processing, silicon wafer services,silicon wafers, silicon, silicon slices, prime silicon wafers, test silicon wafers, particle monitor silicon wafers, furnace silicon wafers, mechanical silicon wafers, silicon wafer processing, silicon wafer services, CRYSTALS, BaB2O4, BaF2, CaF2, LiF, MgF2, KBr, KCl, NaCl, CsI, CaCO3, KRS-5, KRS-6, KDP, KTP, PbMoO4, LiIO3, LiNbO3, Quartz, Sapphire, Scintillators, TeO2, TiO2, Rutile, ZnSe, Thermal Oxide, PSG/BPSG, Plasma Nitride, Polysilicon, Photolithography, Epitaxy, Metals, Photo Resist Coating, LPCVD Silicon Nitride, Plasma Oxide, TEOS Oxide, LTO Silicon Wafers, GaAs, Ge, InP, SOI, GaN, Fused Silica, Quartz Wafers, Fused Silica and Quartz Wafers, Ge, ultra-thin si wafer needs of fabs, equipment manufacturers, R&D houses, colleges and universities silicon wafers, silicon wafer, silicon, wafer, wafers, silicon, silicon wafer manufacturing, silicon wafer distributing, silicon wafer supply, silicon wafer vendor, silicon slices, test wafers, prime wafers, particle wafers, monitor wafers, particle monitor wafers, 100mm silicon wafers, 125mm silicon wafers, 150mm silicon wafers, 200mm silicon wafers, 300mm silicon wafers, 4 inch silicon wafers, 5 inch silicon wafers, 1 inch silicon wafers, 3 inch silicon wafers, 2 inch silicon wafers, silicon wafers, wafer processing, Gallium Arsenide, GaAs, Ga, Gallium, Arsenide, InP, GaN, Ge, Germanium, GaAs reclaim, wafer reclaim, silicon wafer processing, silicon processing, wafer services, silicon wafer services, epi wafers, passivation, wafers, oxide wafers, epitaxial wafers, si, Si, silicon test wafers, silicon prime wafers, silicon monitor wafers, silicon particle wafers, silicon mechanical wafers, silicon test slices, Virginia Semiconductor, Novotech, Telecom-STV TaxCaffe The Art of Tax Research tax,tax research,income,income tax,small business,tax compliance,tax audit,tax examination,semiconductor taxes TaxCaffe is a multistate tax analysis firm offering support to small businesses and individuals. Main services offered are tax research, tax compliance, instant online access to a large array of tax issues, audit support and business friendly states analysis. Major industries served are semiconductors and software development. For more information on the type of services we offer and the related cost please follow the links. TaxCaffe is a tax analysis firm offering support to small business and individuals. We are not looking to replace your current tax preparer be it a CPA, tax attorney or enrolled agent. The tax impact of your business decisions is best known prior to the point of no return. A reputable tax advisor will be able to provide clients with a concise tax analysis reflecting the supporting rationale to the question or issue raise by the client. It might be brought upon the tax professional the role of not only advisor but also planner, when creative ideas are expected. There are times when the ultimate decision belongs to the well informed client.

	CONTACTS	REQUEST QUOTE	CUSTOMER LOGIN	ORDER ONLINE
	HTE LABS CAPABILITIES	BIPOLAR WAFER FOUNDRY	BUILD PROCESS RUN CARD ON LINE
	DEVICE MODELING	5V BIPOLAR PROCESS	SUBSTRATE MATERIALS	LPCVD DEPOSITIONS
	CIRCUIT SIMULATION	10V BIPOLAR PROCESS	SUBSTRATE CLEANING	PECVD DEPOSITIONS
	LAYOUT DESIGN	20V BICMOS PROCESS	EPITAXIAL DEPOSITION	SPUTTER DEPOSITIONS
	PROCESS SIMULATION	20V BIPOLAR PROCESS	OXIDATION	LIFT OFF PROCESS
	MASKS MANUFACTURING	25V SUPER BETA PROCESS	PHOTOLITHOGRAPHY	BACKLAP / POLISH
	WAFER FOUNDRY	25V BIPOLAR + JFET PROCESS	WET ETCHING	BACKSIDE METALLIZATION
HTE Labs	WAFER PROBE TEST	25V BIPOLAR +DMOS PROCESS	KOH ANISOTROPIC ETCH	ANNEAL
	LASER TRIM / MACHINING	45V BIPOLAR PROCESS	MESA ETCH	E-TEST
	BACK GRIND / POLISHING	75V BIPOLAR PROCESS	DRY ETCH	WAFER PROBE
SEMICONDUCTORS	BACKSIDE METALLIZATION	100V BIPOLAR PROCESS	DOPING	SOLDER BUMPING
WAFER FOUNDRY	PACKAGING	150V BIPOLAR PROCESS	ION IMPLANT	DICING
APPLIED THIN FILMS	FAILURE ANALYSIS	300V BIPOLAR PROCESS	DIFFUSION	DIE ATTACH
CONTRACT R&D SUPPORT	LIFE TEST CLASS H	400V BIPOLAR PROCESS	ANNEAL/DIFFUSION	WIRE BONDING
	SEM	500V BIPOLAR PROCESS	SOG DEPOSITIONS	PACKAGING MOLDING

TECHNOLOGIES SPECIALTY WAFER PROCESSING
	ADVANCED INTERCONNECT TECHNOLOGY SILICON PCBOARD	NANOELECRONICS FOUNDRY SERVICES
	BIOCHIP TECHNOLOGY	NON VOLATILE MEMORY RESEARCH
	CHIP SCALE PACKAGING	OPTOELECTRONIC DEVICE MANUFACTURING
	CUSTOM DISCRETE ACTIVE AND PASSIVE COMPONENTS	RAD-HARD, RADIATION HARDENED TECHNOLOGIES
	CUSTOM IC'S DESIGN AND MANUFACTURING	RF MEMS - SMART RF MEMS
	CUSTOM THIN FILM PRODUCTS DEVELOPMENT	SENSORS - SMART SENSORS
	DIELECTRIC ISOLATED BIPOLAR ,CMOS, DMOS TECHNOLOGY	SOI & BONDED WAFERS TECHNOLOGY DEVELOPMENT
	FLIP CHIP TECHNOLOGY	SOLDER BUMP AND GOLD BUMP SERVICES
	HIGH TEMPERATURE APPLICATIONS SEMICONDUCTORS	SAW - SURFACE ACOUSTIC WAVE TECHNOLOGY
	MEMS FOUNDRY	THIN FILM PLASMA DISPLAY TECHNOLOGY
	MOLYBDENUM, TUNGSTEN, REFRACTORY METAL GATE CMOS	WAFER SCALE PACKAGES SILICON PC BOARD MANUFACTURING

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HTE Labs	HTE LABS is a division of SEMICONIX CORPORATION			HTE Labs
	Headquarters Address	Webmaster: Semiconix Design	Location / Map / Directions
	2968 Scott Blvd	Tel:(408)-986-8026	CONTACT
	Santa Clara, CA 95054-3322	Fax:(408)986-8027	http://www.htelabs.com
	United States of America
	HTE LABS is a division of SEMICONIX CORPORATION

HTE LABS

2968 Scott Blvd. Santa Clara, CA 95054-3322 USA Tel:(408)986-8026 Fax:(408)986-8027

HTE LABS

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Glossary of terms Following glossary of terms is a list of all topics that are presented in this web site. Visitor can search this web site simply by looking up a topic from the glossary of terms. Each term is linked to a primary web page that best describes respective topic. For in depth search of a topic, both on this web site or on the world wide web visitors are advised to use the search command.

A

B

C

D

E

F

G

H

I

J

K

L

M

N

O

P

Q

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T

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X

Y

Z

A == Active base Adhesion, adhesion promoter Ag, see silver Air annealing, air fiering Al, aluminum, aluminum deposition, aluminum etch, aluminum film, aluminum metallization, aluminum sputtering AlN, Aluminum nitride metallized substrate Al2O3, aluminum oxide, alumina Alloying Ammonium fluoride etching solution Amorphous silicon, a:Si Anisotropic etching Annealing, nitrogen, air Anodization solution As, Arsenic implant, arsenic diffusion, arsenic doped silicon Antimony, Antimony diffusion, Antimony implant, Sb implant, antimony doped silicon Ar, argon sputter clean, sputter etch Ashing Au, Au-Ge, Au-In, Au-Si, Au-Sn Avalanche Breakdown B == Backlap and polish, backlaping Barrel etch reactor, LFE Base contact, base diffusion, base junction, base implant, base mask, base oxide, base resistance Beam leads Be, Beryllium, BeO, Beryllium Oxide Bevel and stain epitaxial layer thickness measurement BHF, bufferd hydrofluoric etching, BOE, bufferd oxide etch Bipolar transistor, bipolar process, bipolar foundry, bipolar wafer, bipolar device, bipolar integrated circuit Bird beak and bird crest BJT, bipolar junction isolated transistors Bonding pad, Bond pad B, Boron implant, Boron doped oxide, Boron doped silicon Bipolar process Bipolar transistor, bipolar transistor doping profile, bipolar wafer foundry Breakdown voltage, BVcbo, BVceo, BVebo, BVsd, BVgd Bump, gold bump process, underbump metallization Buried layer, buried collector C == Capacitance, junction capacitance, parasitic capacitance Carrier concentration Capacitors, MOS, MNOS, MIS, MIM CF4 plasma etch Channel stop, ion implanted channel stopper, channel implant Chemical etchants, chemical etch of metals, chemical etch of silicon, chemical etch of oxide Chip, chip capacitor, chip inductor, chip resistor Cleaning, diffusion cleaning, tube cleaning Cl, Chlorine oxidation, plasma etch Contract fabrication Cr, Chromium sputter deposition, etch, masks Certificate of conformance Class 10 clean room, Class 10 laminar flow hood CMOS, complimentary metal oxide semiconductor Collector contact, collector diffusion, collector junction, collector implant, collector mask, collector oxide, collector resistance Complimentary bipolar process, transistors Complimentary bipolar process, Complimentary bipolar foundry, Complimentary bipolar wafer, Complimentary bipolar integrated circuit Contacts to silicon, silicide, resistor film, contact etch, contact printing, contact resistance Cu, copper film, copper deposition, copper electroplating, copper etch, copper sputtering, copper metallization Copper displacement plating solution CP-4, CP-6, CP-8 etchants, composition, etch rates C-V measurement CZ silicon, Czochralski grown silicon D == DC Magnetron sputtering Dehydration, Dehydration oven, dehydration treatment Depletion mode transistors, depletion layer width Deposition, deposition services Deposited films, deposited metals, deposited nitride, deposited oxides, deposited silicon Deposition rate, sputtering, PECVD, LPCVD, electroplating Design Device design, device manufacturing, device processing, device reliability DI water, deionised water Dielectrics, dielectric films, dielectric constant of materials Diamond like film deposition Dicing saw, wafers, ceramic, quartz Die bonding, die attach, die atach eutectic Dielectric constant of various common ceramic materials Dielectric depositions, reactive sputtered dielectric deposition, PECVD dielectric deposition, spin on glass Die Dicing, see sawing Diffused capacitors, diffused diodes, diffused junctions, diffused resistors Diffusion, diffusion cleaning, diffusion layer, ion implanted source, lateral diffusion, open tube, diffusion doping profile Diffusion furnace operating conditions, ramping rates,diffusion and oxidation Diffusion tube, diffusion tube cleaning, diffusion cleaning, diffusion preclean Diodes, diffused diodes, junction diodes, photo diodes, schottky diodes, zenner diodes doping profile Discrete semiconductor components DMOS Doped Oxide, Doped polysilicon, silicon Doping, vapor phase doping, in situ doping, ion implant doping Doping profile of bipolar transistors, doping profile of diffused junctions Dry oxidation of silicon, dry oxide E == Electromigration Electron mobility Electroplating, electroplating solution Ellipsometer Emitter balasted transistor Emitter diffusion, emitter push effect,emitter implant, emitter mask, emitter oxide, emitter resistance, emitter washout process Enhancement mode transistors Epi deposition, Epitaxy, epitaxial devices, epitaxial deposition, epitaxial layers, epitaxial layer thickness measurement epitaxial layer pattern shift and pattern distorsion Erfc diffusion, erfc profile Etch, Etching, anisotropic, isotropic etching, etch profile Etchants for oxide, nitride, metals Etch rates for plasma etch, etch rates for wet etch, etch rate for sputter etch process Eutectic, eutectic die attaching F == Fe2O3, see iron oxide Field effect transistor Field implant, field oxide Film, films, film deposition, film deposition conditions, sputtering, LPCVD, PECVD Film properties of oxides, film properties of nitride Fixed oxide charge Float zone silicon Fluorine gas plasma etch of Si, SiO2, Si3N4, metals Four point probe measurement, 4pp instrument, 4pp measurements Four-point probe methode Fundamental constants Furnace operating conditions, ramping rates and insertion rates FZ, float zone silicon G == Gain bandwidth product Ga, Gallium, Gallium arsenide, GaAs, GaAs processing Gas, Gases, gas plasma etch, gas supply, gas distribution, gas phse deposition Gaussian diffusion profile Gate, Gates, see MOS gates, Schottky gates Germanium, Ge Gettering, gettering of heavy metals via Chlorine oxidation Glass substrates, glass deposition Gold deposition, gold doping, gold films, gold etch, gold electroplating, gold diffusion, gold sputtering, gold alloying Gold bump process Grain boundary, Polysilicon grain boundary Guard ring diffusion, guard ring implant, guard ring layout design H == Hall effect, hall mobility, hall sensors Halogen, halogen plasma etch, halogenic oxidation Heavy doping Hexamethyldisilizane, see HMDS Heteroepitaxy High resistivity silicon, FZ, float zone silicon High resistivity water High temperature annealing Hillocks Hole mobility Horizontal reactor Hot wall reactor Hydrogen, Hydrogen anneal, Hydrogen diffusion, hydrogen flow HCl, hydrogen chloride etch, hydrogen chloride oxidation HF, hydrogen fluoride etching solution NH4F ammonium fluoride etching solution Hydrophobic surface HMDS, HMDS spin coating, HMDS adhesion promoter Hyperabrupt junction diodes, Hyperabrupt profile, Hyperabrupt Schottky diodes I == Image reversal photoresist Implant, Implanted resistors Impurity concentration, impurity diffusion, impurity gradient, impurity profile, impurity redistribution Index of refraction In-situ etching, in-situ doping, in-situ cleaning Integrated circuit process sequence Interconnections,single metal interconnections, double metal interconnections Interstital Intrinsic carrier concentration, intrinsic gettering Iodine, Iodine etch, KI solution Ion dose, Ion implant, ion implantation, ion implant activation, ion implant doping profile, implant dose, ion implantation Ion implanted JFET Ion implanted buried layer, Ion implanted collector, ion implanted base, ion implanted emitter Ion implanted source, Ion implanted Drain Ion implanted resistor IPA, IPA dry, Isopropyl alcohol Iron Iron oxide film, iron oxide deposition, iron oxide masks ISO 9000 compliance, ISO 9000 compliant Isolation, isolation diffusion, isolation mask J == JFET, J-FET diffused Junction curvature, junction delineation, junction diffusion, junction depth, junction formation, junction isolation, junction lag, junction staining Junction diode, junction field effect transistor K == K, see potasium KOH, KOH etch, KOH anisotropic etch, KOH silicon etch KTFR, see negative resist, negative photoresist L == Laminar flow, laminar flow hood Laser, Laser annealing, laser drilling, laser cutting, laser machining,laser trim of thin film resistors Lateral diffusion, lateral spread Lateral p-n-p transistor, lateral PNP transistors Lifetime Lift-off process Linear oxidation rate constant LiNbO3 process Layout design Loading effect Local oxidation, LOCOS, Locally oxidized transistor Low reverse gain transistors LPCVD epitaxial deposition, LPCVD epitaxial process LPCVD nitride deposition, LPCVD nitride process LPCVD oxide deposition, LPCVD oxide process LPCVD Polysilicon deposition, LPCVD Polysilicon process Low pressure chemical vapor deposition Low pressure reactor M == Magnetron Mask, mask design, mask manufacturing,manufacturing borosilicate mask, chrome mask, low reflectivity chrome mask, e-beam mask, emulsion mask, iron oxide mask, see through mask, silicon mask, sodalime glass mask, master mask, reticle, working mask Mask alignment, mask alignment keys Masking Mass flow controller Measurement, 4pp measurement, sheet resistance measurement, thickness measurement, refractive index measurement Measurement of resistivity MEMS, MEMS contract fabrication, MEMS process development, MEMS wafer foundry Mesa etch, mesa isolation MESFET Metallization and Lift-off, multi-layer metallization, single-layer metallization, multi-level metallization, single-level metallization Metal, Metals deposition, metal films, metal etch, metal mask, metal patterning Metal oxides, metal nitrides, metal silicides Metalorganic Metals refractory Metal Oxide Semiconductor, MOS, MOS transistor, MOSFET Metal semiconductor junction, Schottky barrier diode Military standard, MIL 883 MNOS transistors Mobility Molecular beam epitaxy Mo, Molybdenum, Molybdenum deposition, molybdenum sputtering, molybdenum film, molybdenum etch, molybdenum gate, molybdenum metallization, molybdenum interconnection layer MOS, MOSFET MOS capacitor, MOS devices, MOS transistor Multi-emitter transistor, multiple diodes, multiple implants N == Narrow slot, diffusion N-channel transistor Nitrogen annealing,nitrogen flow NMOS Non volatile memory NPN transistor n+ - p - n+ transistor O == Ohmic contact, ohmic contacts to silicon, ohmic contacts to silicides Optical mask, optical printing, optical printer Optoelectronic application, optoelectronic devices Organometalic Orientation of silicon, orientation effects Overetch Oxidation, oxidation rate, Oxidation-induced stacking faults, oxidation tube, oxidation furnace Oxide deposition, oxide etch, oxide isolation, oxide isolated Oxide color chart, oxide masking properties, oxide growth rate, oxide isolation Oxygen, oxygen plasma,oxygen flow P == Pad oxide and silicon nitride deposition, bird beak and bird crest Palladium, Palladium deposition, Palladium sputtering, Palladium film, Palladium etch, Palladium metallization, Palladium silicide Parabolic oxidation rate constant Parasitic capacitance, parasitic junction Partial pressure Paper less Passive components Pattern, pattern delineation, pattern generation, pattern shift, pattern distorsion P-channel JFET,p-channel transistor Pd, Palladium, Palladium deposition, Palladium sputtering, Palladium film, Palladium etch, Palladium metallization, Palladium silicide PECVD see plasma enhnced chemical vapor deposition, PECVD Nitride deposition, PECVD Oxide deposition, PECVD amorphous silicon deposition Penetration depth, ion implant depth Peritectic reaction Permalloy Permeability Phosphoric acid etch of silicon nitride, Phosphoric acid and aluminum etch, H3PO4 Phosphorus, Phosphorus diffusion, Phosphorus ion implant, Phosphorus doped silicon,Phosphorus doped glass Phosphosilicate glass Photolithography Photoresist, photoresist coating, photoresist masking, negative photoresist, positive photoresist, photoresist removal, photoresist strip, photoresist ashing, photoresist develop, photoresist expose, photoresist soft bake, photoresist hard bake, photoresist adhesion, photoresist UV flood exposure, photoresist image reversal Pinch off voltage Pinch resistor Planar process, planar technology, planar junction, planar reactor, planar plasma etch reactor, planarization Plasma, plasma anodization, plasma ashing, plasma assisted etching, plasma etch, plasma etching, plasma clean,plasma reactor Plasma Enhanced chemical vapor deposition, see PECVD, Nitride deposition, PECVD Oxide deposition, PECVD amorphous silicon deposition Plating, plated gold, plated copper, plated silver, plating solution Platinum, see Pt, Platinum deposition, Platinum sputtering, Platinum film, Platinum etch, Platinum metallization, Platinum silicide pn junction PNP transistor Polycrystaline silicon Polishing, Polishing etch, polished wafers, polished ceramic, polished silicon, polished quartz wafers, polished glass wafers Polymide Polysilicon emitter, Polysilicon deposition, Polysilicon sputter deposition, Polysilicon oxidation, Polysilicon doping, Polysilicon etching, Polysilicon anisotropic plasma etching, LPCVD undoped polysilicon deposition, Polysilicon gate, Polysilicon growth Positive resist, positive photoresist Printing, contact printing, optical printing, projection printing, proximity printing, printing defects Process control, process development, process flow, process run sheet, process run traveller, process work sheet Projected range and ion implantantion Projection printing Proximity printing PSG, see Phosphorus doped glass Pt, see Platinum, Platinum deposition, Platinum sputtering, Platinum film, Platinum etch, Platinum metallization, Platinum silicide Purple plague and gold aluminum intermetallics Pyrogenic oxidation process, Pyrogenic oxide Q == Quality, Quality audit, Quality manual, Quality system Quartz, Quartz boat, Quartz deposition, quartz mask, Quartz polishing, Quartz tube, Quartz substrate, Quartz wafer R == R&D, R&D contract, R&D facility, R&D support, R&D wafer fab, R&D wafer foundry Radial resistivity Ramping rate Reactive ion etching, see RIE Reactive sputtering Reactor, barrel reactor, low pressure reactor, planar reactor, tunnel reactor Refractive index measurement Refractory metals Reflow methode, reflow of doped oxide, reflow of photoresist Registration between mask layers Reliability, reliable metallization, reliable process Research and development contract, Research and development facility, Research and development support, Research and development wafer fab, Research and development wafer foundry Residual film stress Resist, see photoresist Resistance Resistor, resistors, diffused resistors, implanted resistors, thin film resistors, pinch resistors, resistor trim Resistivity, resistivity measurement, resistivity versus temperature, see TCR Reticle, reticle mask, see also mask stepper RF magnetron, RF plasma etch RIE, see reactive ion etching also Rsq, sheet resistance measurement Run sheet Run traveller S == Sapphire, Sapphire substrate, Sapphire polishing, Sapphire diceing Saw, sawing, sawing process, sawing service Scribe line, scribing Sealed junction technology Selective epitaxy, selective etching Se, Selenium Self aligned gate process, self alignment, self aligning methode Self isolated transistor, self isolation Semiconductor, semiconductor components, semiconductor equipment, semiconductor processing, semiconductor services Semi-insulating Shallow diffusion, shallow junction, shallow implant, shallow impurities Silane, SiH4 SiC, silicon carbide, silicon carbide deposition SiCr, sichrome films, sichrome deposition SiN, Si3N4 Silica glass, silica etch, see oxide etch Silicon components Silicon integrated circuits SiO2, SiO, SiOxNy, SIPOS Silicide etch, silicide growth, silicide oxidation, silicide properties Silicides, Ti, Ta, Pt, Mo Silicon dioxide, Silicon dioxide etch, Silicon dioxide plasma etch, Silicon dioxide deposition Silicon nitride, silicon nitride deposition, silicon nitride etch rate, silicon nitride film properties, silicon nitride refractive index Silicon anisotropic etches, see KOH etch and plasma anisotropic etch of silicon and polysilicon Silicon annealing, silicon anodization, silicon cleaning, silicon cleaving, silicon crystalographic etches, silicon etch rates Silicon polishing etches Silicon denuded zone formation Silicon dioxide, SiO2, Silicon dioxide etch, Silicon dioxide film, Silicon dioxide growth, Silicon dioxide deposition Silicon dioxide reactive sputter deposition, Silicon dioxide PECVD deposition, Silicon dioxide LPCVD deposition Silicon dioxide refractive index, Silicon dioxide color chart, Silicon dioxide dielectric properties, Silicon dioxide plasma etch Silicon dioxide anisotropic plasma etch, Silicon dioxide BOE etch, Silicon dioxide BHF etch Silicon nitride, SiN, SixNy, Si3N4, Silicon nitride, SiO2, Silicon nitride etch, Silicon nitride film, Silicon nitride growth, Silicon nitride deposition, Silicon nitride reactive sputter deposition, Silicon nitride PECVD deposition, Silicon dnitride LPCVD deposition Silicon nitride refractive index, Silicon nitride color chart, Silicon nitride dielectric properties, Silicon nitride plasma etch Silicon nitride anisotropic plasma etch, Silicon nitride H3PO4 etch, Silicon nitride phosphoric acid etch, Silicon nitride HF etch Silicon on sapphire Silicon oxynitride Silver deposition, Silver bump, Silver films, Silver etch, Silver electroplating, Silver sputtering Schottky, Schottky barrier diodes, Schottky barrier junction, Schottky contacts, Schottky defects, Schottky clamp diodes, Schottky cleaning, Schottky films, Hyperabrupt Schottky diodes Schottky clamped process Sheet resistance measurement, base sheet resistance, emitter sheet resistance, epi layer sheet resistance Sn see tin deposition SnO2 see tin oxide deposition SnPb 60-40 see tin-lead deposition Sodium gettering, sodium passivation Solid solubility SOS transistors, SOS process Sorce - drain contacts, Sorce - drain layout, Sorce - drain diffusion, Sorce - drain implant SPC, see statistic process control Sputter cleaning sputter deposition Sputtering, sputtering yields Sputtered films, sputtered aluminum, sputtered aluminum nitride, sputtered copper, sputtered chrome, sputterd gold, sputtered iron oxide, sputtered molybdenum, sputtered nickel, sputtered nickel - chrome, sputtered nickel - vanadium, sputtered silicon, sputtered silicon nitride, sputtered silver, sputtered tin, sputtered tin oxide, sputtered tin lead, sputtered titanium, sputtered tantalum, sputtered tantalum silicide, sputtered tantalum nitride, sputtered tungsten, sputtered zirconium Stacking fault method, Stacking faults, Stacking fault etch Statistic process control Steam oxidation Step coverage Step junction Step and repeat Stepper Stirring Stress Substrate holder, Sulfur hexafluoride plasma etch Superbeta transistors Surface barriers metal semiconductor, surface charge, surface resistivity Surface concentration, surface inversion, surface mobility, surface reflectivity Susceptor T == Ta, Tantalum, Tantalum deposition, Tantalum sputtering, Tantalum film, Tantalum etch, Tantalum metallization, Tantalum silicide TaN, Tantalum Nitride deposition, Tantalum Nitride sputtering, Tantalum Nitride film, Tantalum Nitride etch Tantalum Nitride Thin film resistors TaSi2, Tantalum Silicide deposition, Tantalum Silicide sputtering, Tantalum Silicide film, Tantalum Silicide etch Tantalum Silicide thin film resistors Ta TiW Au TaN TiW Au Te, Tellurium deposition, ......... Thermocompression bonding Thin film resistors deposition, thin film resistors plasma etch, thin film resistors lift-off process, thin film resistors patterning Thin film resistors stabilization process, thin film resistors annealing process, thin film resistors process Ti, Titanium, titanium deposition, titanium etch, titanium silicide, titanium silicidation TiN, titanium nitride deposition, titanium nitride properties, titanium nitride wet etch, titanium nitride plasma etch TiW, titanium-tungsten deposition, titanium-tungsten properties, titanium-tungsten wet etch, titanium-tungsten plasma etch Ti Ni Ag Ti NiV Ag Ti Pd Au Ti Pt Au TiW Au TiW TiWNx TiW Au TCR, see thermal coefficient of resistance Thermal coefficient of resistance Thermal oxide, thermal oxidation, thermal anneal, thermal processing, thermal treatment Thin film deposition, thin film sputter deposition, thin film sputtering deposition, thin film devices, thin film resistors Thickness measurement Threshold voltage Transistor, bipolar transistor, emitter ballasted transistor, field effect transistor, low reverse gain transistor, MOS transistor, multi-emitter transistor, self-isolated transistor, superbeta transistor, NPN transistor, PNP transistor, lateral PNP transistor, vertical NPN transistor, vertical PNP transistor, TMOS transistor, Triply diffused transistor Triply diffused process Tube, tube cleaning, diffusion tube cleaning Tungsten,W, tungsten sputtering deposition, tungsten etch, tungsten silicide, tungsten silicidation Tungsten nitride, WNx, tungsten nitride deposition, tungsten nitride reactive sputtering deposition, tungsten nitride properties, tungsten nitride wet etch, tungsten nitride plasma etch Tunnel reactor Twin tabs, twin diffusion tabs Two-step diffusion U == Ultasonic bonding Ultrasonic cleaning Undercut Universal constants UV exposure, UV flood exposure V == V/I, 4pp measurement of V/I Van der Pauw, Van der Pauw measurement, Van der Pauw structure design Vapor dry in IPA, IPA dry, Isopropyl alcohol vapor dry Vendor, vendor quality system audit VMOS Vertical NPN transistors Vertical PNP transistors Vertical reactor Voltage breakdown, BVcbo, BVceo, BVebo, BVsd, BVgd W == W, tungsten, W PtSi Si Wafer bumping process, services Wafer cleaning procedures Wafer dicing Wafer fab, wafer fabrication, wafer process, wafer processing Wafer foundry Wafer thinning, wafer thinning process, wafer thinning procedure Washout, washout emitter, emitter washout process Water, DI water, deionised water, high resistivity water Wet etch, wet etching, wet anisotropic etch Wet oxide, wet oxidation process Work in progress, WIP Work sheet Working mask X == X-ray printing Y == Yield, Yield enhancement, Yield specification Z == Zinc, Zn ZnO, zinc oxide Zr, Zirconium Zenner diodes Zero bias diode, ZBD

BIPOLAR PROCESS	ANNEAL/OXIDATION	ELECTROLESS	ELECTROCHEMICAL	EPITAXIAL	ION	LIFT OFF
WAFER FOUNDRY	DIFFUSION	DEPOSITION	DEPOSITION	DEPOSITION	IMPLANT	PROCESSES
5V BIPOLAR PROCESS	Antimony, Sb	Copper, Cu	Au, gold plating	Si, silicon	Argon	Cr/Au
10V BIPOLAR PROCESS	Arsenic, As	Gold, Au	Cu, Copper plating	SiGe	Arsenic	Ti/Ni/Ag
20V BICMOS PROCESS	Boron, B	Nickel, Ni		SiC	Antimony	Ti/Ni/Au
20V BIPOLAR PROCESS	Phosphorous, P	Tin, Sn			Boron	Ti/Pd/Au
25V SUPER BETA PROCESS	Argon Anneal				Hydrogen	Ti/Pt/au
25V BIPOLAR + JFET PROCESS	N2/H2 Anneal				Nitrogen	Ti/Au
25V BIPOLAR +DMOS PROCESS	Argon+ H2 Anneal				Oxygen	TiW/Au
45V BIPOLAR PROCESS	N2 anneal				Phosphorous	Pt
75V BIPOLAR PROCESS	O2, Dry Oxidation					Ti
100V BIPOLAR PROCESS	O2+H2 oxidation					W
150V BIPOLAR PROCESS						Mo
300V BIPOLAR PROCESS
400V BIPOLAR PROCESS
500V BIPOLAR PROCESS
LPCVD	MASKS	PECVD	PHOTOLITHOGRAPHY	PLASMA /RIE	SPIN ON GLASS	SPUTTERING
PROCESSES	MANUFACTURING	PROCESSES	PROCESSES	ETCH PROCESS	PROCESSES	DEPOSITIONS
LPCVD nitride		PECVD Oxide		OXIDE etch		Al, Aluminum
LPCVD polysilicon		PECVD Nitride		NITRIDE etch		Al,1%Si alloy
		Amorphous Silicon		POLY. etch		Al,1%Si,Cu alloy
				Silicon etch		AlN/Aluminum Nitride
						Au, Gold
						C, Carbon
						Cr, Chromium
						Cu, Copper
						Fe2O3, Iron oxide
						ITO - InSnOx
						Pb, Lead
						Mo, Molybdenum
						NiCr, Nickel-Chromium
WAFER BONDING						NiV,Nickel-Vanadium
						Pd,Palladium
						Pt, Platinum
						Si, Silicon
						SiC, Silicon Carbide
						Si3N4,Silicon Nitride
						Ag, Silver
						Ta, Thantalum
						TaSi2, Tantalum Silicide
						Sn, Tin
						SnO, Tin Oxide +In
						Ti, Titanium
						TiN, Titanium Nitride
						W, Tungsten
						Zn, Zinc
						ZnO, Zinc Oxide
						Zr, Zirconium
						ZrO2, Zirconium Oxide